21. Silicide technology for integrated circuits   Publication: London : Institution of Electrical Engineers, 2004 . 1 online resource (xviii, 279 p.) : Date:2004 Availability: No items available: Actions: Add to cart
22. ISTFA '97   Publication: Materials Park, OH : ASM International, 1997 . 1 online resource (xix, 346 p.) : , "Manager of Book Production Grace M. Davidson." Date:1997 Availability: No items available: Actions: Add to cart
23. ISTFA '98   Publication: Materials Park, OH : ASM International, 1998 . 1 online resource (xix, 490 p.) : Date:1998 Availability: No items available: Actions: Add to cart
24. Microelectronic failure analysis   Publication: Materials Park, OH : ASM International, 2001 . 1 online resource (v, 171 p.) : Date:2001 Availability: No items available: Actions: Add to cart No cover image available No cover image available
25. ISTFA 2001   Publication: Materials Park, OH : ASM International, 2001 . 1 online resource (xix, 485 p.) : , Sponsored by EDFAS, ISTFA. Date:2001 Availability: No items available: Actions: Add to cart No cover image available No cover image available
26. Microelectronic failure analysis   Publication: Materials Park, Ohio : ASM International, 2002 . 1 online resource (vi, 210 p.) : Date:2002 Availability: No items available: Actions: Add to cart
27. ISTFA 2003   Publication: Materials Park, Ohio : ASM International, 2003 . 1 online resource (518 p.) : Date:2003 Availability: No items available: Actions: Add to cart No cover image available No cover image available
28. Microelectronics failure analysis   Publication: Materials Park, Ohio : ASM International, 2004 . 1 online resource (xiv, 800 pages) : Date:2004 Availability: No items available: Actions: Add to cart
29. ISTFA 2005   Publication: Materials Park, OH : ASM International, 2005 . 1 online resource (xviii, 524 p.) : Date:2005 Availability: No items available: Actions: Add to cart No cover image available No cover image available
30. ISTFA 2006   Publication: Materials Park, OH : ASM International, 2006 . 1 online resource (xx, 524 p.) : Date:2006 Availability: No items available: Actions: Add to cart
31. ISTFA 2007   Publication: Materials Park, OH : ASM International, 2007 . 1 online resource (xvi, 356 p.) : Date:2007 Availability: No items available: Actions: Add to cart
32. Microelectronics failure analysis   Publication: Materials Park, Ohio : ASM International, 2011 . 1 online resource (xi, 660 p.) : , "ASM International, 2011, no. 09110Z"--P. 4 of cover. | Some online versions lack accompanying media packaged with the printed version. Date:2011 Availability: No items available: Actions: Add to cart
33. Polymer thin films   Publication: Singapore ; | Hackensack, NJ : World Scientific, 2008 . 1 online resource (x, 301 p.) : Date:2008 Availability: No items available: Actions: Add to cart
34. Hermeticity of electronic packages by Greenhouse, Hal. Publication: Park Ridge, N.J. : | Norwich, N.Y. : Noyes Publications ; | William Andrew Pub., 2000 . 1 online resource (xiv, 416 p.) : Date:2000 Availability: No items available: Actions: Add to cart
35. Polymers in electronics by Cousins, Keith. Publication: Shawbury, U.K. : Rapra, 2006 . 1 online resource (iv, 120 p.) , Title from title screen. Date:2006 Availability: No items available: Actions: Add to cart
36. Single-electron devices and circuits in silicon by Durrani, Zahid Ali Khan. Publication: London : Imperial College Press, 2010 . 1 online resource (xiv, 285 p.) : Date:2010 Availability: No items available: Actions: Add to cart
37. Microelectromechanical systems   Publication: Washington, DC : National Academy Press, 1997 . 1 online resource (xiv, 61 pages) : Date:1997 Availability: No items available: Actions: Add to cart
38. Electronic materials science by Irene, Eugene A. Publication: Hoboken, N.J. : John Wiley, 2005 . 1 online resource (xiii, 306 p.) : , "Wiley-Interscience." Date:2005 Availability: No items available: Actions: Add to cart
39. GaN-based materials and devices   Publication: River Edge, N.J. ; | London : World Scientific., 2004 . 1 online resource (x, 284 p.) : Date:2004 Availability: No items available: Actions: Add to cart
40. Materials for high-density electronic packaging and interconnection   Publication: Washington, D.C. : National Academy Press, 1990 . 1 online resource (xiv, 139 p.) : , Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. | Available from Defense Technical Information Center, Cameron Station. | "NMAB-449." Date:1990 Availability: No items available: Actions: Add to cart