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21. |
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Materials for high-density electronic packaging and interconnection
Publication:
Washington, D.C. : National Academy Press, 1990
. 1 online resource (xiv, 139 p.) :
, Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. | Available from Defense Technical Information Center, Cameron Station. | "NMAB-449."
Date:1990
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22. |
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Food contact rubbers 2
by Forrest, Martin J.
Publication:
Shawbury, U.K. : Rapra Technology Ltd., 2006
. 1 online resource (148 p.) :
Date:2006
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23. |
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Reflow soldering processes
by Lee, Ning-Cheng.
Publication:
Boston : Newnes, 2002
. 1 online resource (ix, 270 p.) :
Date:2002
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24. |
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Handbook of package engineering.
Publication:
New York , McGraw-Hill, 1971
. 1 v.
Date:1971
Availability:
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Science & Technology
[Ref TS195 H35]
(1),
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25. |
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Promoting packging for exporters. -
Publication:
Geneva : International Trade Centre Unctad / Gatt. 1975
. vol. :
, At head of title: International Trade Centre Unctad / Gatt.
Date:1975
Availability:
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Science & Technology
[TS195.6 P7]
(2),
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26. |
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Recommended international general standard for the labelling prepackaged foods. -
by Joint FAO/WHO Codex Alimentarius Commission
Publication:
Rome: FAO/WHO, 1969
. 12p. -
Date:1969
Availability:
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Science & Technology
[TX537 J665]
(1),
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27. |
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Recommended international general standard for the labelling prepackaged foods. -
by Joint FAO/WHO Codex Alimentarius Commission
Publication:
Rome: FAO/WHO, 1969
. 12p. -
Date:1969
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28. |
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FAO/WHO Codex Alimentarius sampling plans for prepacked foods (1969 ) (AQL 6.5). -
by Joint FAO/WHO Codex Alimentarius Commission
Publication:
Rome : FAO/WHO, 1972
. iii,15 p. -
Date:1972
Availability:
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Science & Technology
[TX537 J74]
(1),
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